Prepreg is one of the primary materials used in the production of multilayer PC board, mainly composed of resin and glass cloth (reinforcing materials).

Copper foil-clad laminated board is a plate-like material made by covering and hot-pressing one side or both sides of a prepreg with copper foil, abbreviated as copper-clad plate. Copper-clad plate is a core material used in the production of PC board which carries the three major functions of PC board, namely conductivity, insulation, and support. It has a significant impact on the transmission speed, energy loss, and characteristic impedance, etc., of the signals in circuits. Therefore, the performance, quality, processability in manufacturing, manufacturing level, manufacturing cost, and long-term reliability and stability of PC board largely depend on the copper-clad plate. Copper-clad plate and PC board are indispensable and essential components in modern electronic information products, widely used in the terminal fields such as communication, consumer electronics, computers, automotive electronics, aerospace, and industrial control, etc.